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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016January 01, 2016 EDT

Innovated L/S less than 2/2μm Line Embedded 2.1D Organic Substrate Technology

Yu-Hua Chen,
Line Embedded2.1D Organic Substratephoto-sensitive dielectric
https://doi.org/10.4071/2016DPC-WP42
IMAPSource Conference Papers
Chen, Yu-Hua. 2016. “Innovated L/S Less than 2/2μm Line Embedded 2.1D Organic Substrate Technology.” IMAPSource Proceedings 2016 (DPC): 1682–1712. https:/​/​doi.org/​10.4071/​2016DPC-WP42.
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