Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Comparison of hermetic sealing using SAC and SnPb solder for a MEMS pressure sensor
Comparison of hermetic sealing using SAC and SnPb solder for a MEMS pressure sensor
Maaike M. Visser Taklo, Branson Belle, Joachim Seland Graff, Astrid-Sofie Vardøy, Elisabeth Ramsdal,
Visser Taklo, Maaike M., Branson Belle, Joachim Seland Graff, Astrid-Sofie Vardøy, and Elisabeth Ramsdal. 2016. “Comparison of Hermetic Sealing Using SAC and SnPb Solder for a MEMS Pressure Sensor.” IMAPSource Proceedings 2016 (DPC): 464–87. https://doi.org/10.4071/2016DPC-TA32.
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