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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016
January 01, 2016 EDT
Design of TSV-based Inductors for Internet of Things
Bruce C Kim
,
Saikat Mondal
,
TSV
Inductors
Power Supply
•
https://doi.org/10.4071/2016DPC-THA34
IMAPSource Conference Papers
Kim, Bruce C, and Saikat Mondal. 2016. “Design of TSV-Based Inductors for Internet of Things.”
IMAPSource Proceedings
2016 (DPC): 2111–30.
https://doi.org/10.4071/2016DPC-THA34
.
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