Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Use advanced search instead (articles only)
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016
January 01, 2016 EDT
Design of TSV-based Inductors for Internet of Things
Bruce C Kim
,
Saikat Mondal
,
TSV
Inductors
Power Supply
•
https://doi.org/10.4071/2016DPC-THA34
IMAPSource Conference Papers
Kim, Bruce C, and Saikat Mondal. 2016. “Design of TSV-Based Inductors for Internet of Things.”
IMAPSource Proceedings
2016 (DPC): 2111–30.
https://doi.org/10.4071/2016DPC-THA34
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats
