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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016January 01, 2016 EDT

Advancements in Flip Chip Assembly Equipment and Processes

Bob Chylak, Horst Clauberg, Daniel Buergi,
Flip ChipThermocompressProductivity
https://doi.org/10.4071/2016DPC-WP21
IMAPSource Conference Papers
Chylak, Bob, Horst Clauberg, and Daniel Buergi. 2016. “Advancements in Flip Chip Assembly Equipment and Processes.” IMAPSource Proceedings 2016 (DPC): 1328–58. https:/​/​doi.org/​10.4071/​2016DPC-WP21.
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