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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016
January 01, 2016 EDT
Advancements in Flip Chip Assembly Equipment and Processes
Bob Chylak
,
Horst Clauberg
,
Daniel Buergi
,
Flip Chip
Thermocompress
Productivity
•
https://doi.org/10.4071/2016DPC-WP21
IMAPSource Conference Papers
Chylak, Bob, Horst Clauberg, and Daniel Buergi. 2016. “Advancements in Flip Chip Assembly Equipment and Processes.”
IMAPSource Proceedings
2016 (DPC): 1328–58.
https://doi.org/10.4071/2016DPC-WP21
.
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