Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA Applications
Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA Applications
Swapan Bhattacharya, Fei Xie, Daniel F. Baldwin, Han Wu, Kelley Hodge, Qing Ji,
Bhattacharya, Swapan, Fei Xie, Daniel F. Baldwin, Han Wu, Kelley Hodge, and Qing Ji. 2016. “Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA Applications.” IMAPSource Proceedings 2016 (DPC): 2018–53. https://doi.org/10.4071/2016DPC-THA24.