Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA Applications

Swapan Bhattacharya; Fei Xie; Daniel F. Baldwin; Han Wu; Kelley Hodge; Qing Ji

doi:10.4071/2016DPC-THA24

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Bhattacharya, Swapan, Fei Xie, Daniel F. Baldwin, Han Wu, Kelley Hodge, and Qing Ji. 2016. “Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA Applications.” IMAPSource Proceedings 2016 (DPC): 2018–53. https://doi.org/10.4071/2016DPC-THA24.

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