Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Non-Conductive Film (NCF) Underfill: Materials, Performance, and Evolution to Next Generation Devices
Non-Conductive Film (NCF) Underfill: Materials, Performance, and Evolution to Next Generation Devices
Edgardo Anzures, Paul Morganelli, Paul Morganelli, Robert Barr, Jeffrey Calvert, Avin Dhoble, David Fleming, Jong-Uk Kim, Herong Lei, Jürgen Grafe, Julian Haberland,
Anzures, Edgardo, Paul Morganelli, Paul Morganelli, Robert Barr, Jeffrey Calvert, Avin Dhoble, David Fleming, et al. 2016. “Non-Conductive Film (NCF) Underfill: Materials, Performance, and Evolution to Next Generation Devices.” IMAPSource Proceedings 2016 (DPC): 1192–1221. https://doi.org/10.4071/2016DPC-WP12.