Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Embedded Die Packages and Modules for Power Electronics Applications
Embedded Die Packages and Modules for Power Electronics Applications
Lars Boettcher, S. Karaszkiewicz, D. Manessis, A. Ostmann,
Boettcher, Lars, S. Karaszkiewicz, D. Manessis, and A. Ostmann. 2016. “Embedded Die Packages and Modules for Power Electronics Applications.” IMAPSource Proceedings 2016 (DPC): 1918–47. https://doi.org/10.4071/2016DPC-THA14.