Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Laser Direct Patterning of Dry Etch BCB Adhesive Layers for Low Temperature Permanent Wafer-to-Wafer Bonding
Laser Direct Patterning of Dry Etch BCB Adhesive Layers for Low Temperature Permanent Wafer-to-Wafer Bonding
Kai Zoschke, J.-U. Kim, M. Wegner, M. Gallagher, R. Barr, J. Calvert, M. Toepper, K.-D. Lang,
Zoschke, Kai, J.-U. Kim, M. Wegner, M. Gallagher, R. Barr, J. Calvert, M. Toepper, and K.-D. Lang. 2016. “Laser Direct Patterning of Dry Etch BCB Adhesive Layers for Low Temperature Permanent Wafer-to-Wafer Bonding.” IMAPSource Proceedings 2016 (DPC): 1222–54. https://doi.org/10.4071/2016DPC-WP13.