Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
High Speed Electroplating of 200um High Cu Bumps for Die Stacking Architectures
High Speed Electroplating of 200um High Cu Bumps for Die Stacking Architectures
Richard Hollman,
Hollman, Richard. 2016. “High Speed Electroplating of 200um High Cu Bumps for Die Stacking Architectures.” IMAPSource Proceedings 2016 (DPC): 611–30. https://doi.org/10.4071/2016DPC-TP13.