ISSN 2380-4505
Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Evaluation of High-Speed Copper Plating Products for RDL, Micropillar, and Fan-Out Applications
Evaluation of High-Speed Copper Plating Products for RDL, Micropillar, and Fan-Out Applications
Matthew A Thorseth, Mark Scalisi, Inho Lee, Sang-Min Park, Yil-Hak Lee, Jonathan Prange, Masaaki Imanari, Mark Lefebvre, Jeff Calvert,
Thorseth, Matthew A, Mark Scalisi, Inho Lee, Sang-Min Park, Yil-Hak Lee, Jonathan Prange, Masaaki Imanari, Mark Lefebvre, and Jeff Calvert. 2016. “Evaluation of High-Speed Copper Plating Products for RDL, Micropillar, and Fan-Out Applications.” IMAPSource Proceedings 2016 (DPC): 631–49. https://doi.org/10.4071/2016DPC-TP14.