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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016
January 01, 2016 EDT
Testing in-package DRAMs and DFX features in 3D high-bandwidth memory
Chris Nelson
,
testing
DRAM
DFX
3D
high bandwidth
2.5D
system in package
SiP
HBM
•
https://doi.org/10.4071/2016DPC-TA12
IMAPSource Conference Papers
Nelson, Chris. 2016. “Testing In-Package DRAMs and DFX Features in 3D High-Bandwidth Memory.”
IMAPSource Proceedings
2016 (DPC): 306–23.
https://doi.org/10.4071/2016DPC-TA12
.
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