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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016
January 01, 2016 EDT
M-Series with Adaptive Patterning for High-Yield Fan-Out SIP
Craig Bishop
,
Suresh Jayaraman
,
Boyd Rogers
,
Chris Scanlan
,
Tim Olson
,
Adaptive Patterning
Fan-out
System-in-package
•
https://doi.org/10.4071/2016DPC-TP22
IMAPSource Conference Papers
Bishop, Craig, Suresh Jayaraman, Boyd Rogers, Chris Scanlan, and Tim Olson. 2016. “M-Series with Adaptive Patterning for High-Yield Fan-Out SIP.”
IMAPSource Proceedings
2016 (DPC): 751–73.
https://doi.org/10.4071/2016DPC-TP22
.
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