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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016January 01, 2016 EDT

M-Series with Adaptive Patterning for High-Yield Fan-Out SIP

Craig Bishop, Suresh Jayaraman, Boyd Rogers, Chris Scanlan, Tim Olson,
Adaptive PatterningFan-outSystem-in-package
https://doi.org/10.4071/2016DPC-TP22
IMAPSource Conference Papers
Bishop, Craig, Suresh Jayaraman, Boyd Rogers, Chris Scanlan, and Tim Olson. 2016. “M-Series with Adaptive Patterning for High-Yield Fan-Out SIP.” IMAPSource Proceedings 2016 (DPC): 751–73. https:/​/​doi.org/​10.4071/​2016DPC-TP22.
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