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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016January 01, 2016 EDT

2.5D / 3D IC Landscape: Market and Technology Trends

Andrej Ivankovic, Thibault Buisson, Amandine Pizzagalli, Dave Towne, Rozalia Beica,
2.5D / 3D IC landscape MEMS and CIS TSV packaging Market and Technology Trends
• https://doi.org/10.4071/2016DPC-TA11
IMAPSource Conference Papers
Ivankovic, Andrej, Thibault Buisson, Amandine Pizzagalli, Dave Towne, and Rozalia Beica. 2016. “2.5D / 3D IC Landscape: Market and Technology Trends.” IMAPSource Proceedings 2016 (DPC): 260–305. https://doi.org/10.4071/2016DPC-TA11.
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