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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016
January 01, 2016 EDT
2.5D / 3D IC Landscape: Market and Technology Trends
Andrej Ivankovic
,
Thibault Buisson
,
Amandine Pizzagalli
,
Dave Towne
,
Rozalia Beica
,
2.5D / 3D IC landscape
MEMS and CIS TSV packaging
Market and Technology Trends
•
https://doi.org/10.4071/2016DPC-TA11
IMAPSource Conference Papers
Ivankovic, Andrej, Thibault Buisson, Amandine Pizzagalli, Dave Towne, and Rozalia Beica. 2016. “2.5D / 3D IC Landscape: Market and Technology Trends.”
IMAPSource Proceedings
2016 (DPC): 260–305.
https://doi.org/10.4071/2016DPC-TA11
.
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