System level IC packaging - Integration of Key Technologies: TSVs, Interposers, and Advanced IC Packaging

Mike Kelly; Dave Hiner; Marnie Mattei; Rick Reed; Paul Silvestri; Ron Huemoeller

doi:10.4071/2016DPC-TP11

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Kelly, Mike, Dave Hiner, Marnie Mattei, Rick Reed, Paul Silvestri, and Ron Huemoeller. 2016. “System Level IC Packaging - Integration of Key Technologies: TSVs, Interposers, and Advanced IC Packaging.” IMAPSource Proceedings 2016 (DPC): 567–90. https://doi.org/10.4071/2016DPC-TP11.

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