Kelly, Mike, Dave Hiner, Marnie Mattei, Rick Reed, Paul Silvestri, and Ron Huemoeller. 2016. “System Level IC Packaging - Integration of Key Technologies: TSVs, Interposers, and Advanced IC Packaging.”
IMAPSource Proceedings 2016 (DPC): 567–90.
https://doi.org/10.4071/2016DPC-TP11.