Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
System level IC packaging - Integration of Key Technologies: TSVs, Interposers, and Advanced IC Packaging
System level IC packaging - Integration of Key Technologies: TSVs, Interposers, and Advanced IC Packaging
Mike Kelly, Dave Hiner, Marnie Mattei, Rick Reed, Paul Silvestri, Ron Huemoeller,
Kelly, Mike, Dave Hiner, Marnie Mattei, Rick Reed, Paul Silvestri, and Ron Huemoeller. 2016. “System Level IC Packaging - Integration of Key Technologies: TSVs, Interposers, and Advanced IC Packaging.” IMAPSource Proceedings 2016 (DPC): 567–90. https://doi.org/10.4071/2016DPC-TP11.