Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Advances in Aligned Wafer Bonding Enable by High Vacuum Processing
Advances in Aligned Wafer Bonding Enable by High Vacuum Processing
Eric F. Pabo, Christoph Floetgen, Bernhard Rebhan, Razek Nasser,
Pabo, Eric F., Christoph Floetgen, Bernhard Rebhan, and Razek Nasser. 2016. “Advances in Aligned Wafer Bonding Enable by High Vacuum Processing.” IMAPSource Proceedings 2016 (DPC): 488–541. https://doi.org/10.4071/2016DPC-TA33.