Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Thin WLFO and based WLSiP enabling WL3D, realized using Temporary Reconstituted Panel Bonding Technology
Thin WLFO and based WLSiP enabling WL3D, realized using Temporary Reconstituted Panel Bonding Technology
Steffen Kroehnert, Jose Campos, André Cardoso, Mariana Pires, Eoin O'Toole, Raquel Pinto, Emilie Jolivet, Thomas Uhrmann, Elizabeth Brandl, Jürgen Burggraf, Harald Wiesbauer, Julian Bravin, Markus Wimplinger, Paul Lindner,
Kroehnert, Steffen, Jose Campos, André Cardoso, Mariana Pires, Eoin O’Toole, Raquel Pinto, Emilie Jolivet, et al. 2016. “Thin WLFO and Based WLSiP Enabling WL3D, Realized Using Temporary Reconstituted Panel Bonding Technology.” IMAPSource Proceedings 2016 (DPC): 774–808. https://doi.org/10.4071/2016DPC-TP23.
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