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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016
January 01, 2016 EDT
Impact of Top Die Thickness on Cu Pillar Fatigue in Exposed Die 3D Packages
Rahul Agarwal
,
Sukesh Kannan
,
Shan Gao
,
Rick Reed
,
Yong Song
,
JS Paek
,
die thickness
Cu pillar
fatigue
exposed die
3D package
TSV
through silicon via
MCM
•
https://doi.org/10.4071/2016DPC-TP12
IMAPSource Conference Papers
Agarwal, Rahul, Sukesh Kannan, Shan Gao, Rick Reed, Yong Song, and JS Paek. 2016. “Impact of Top Die Thickness on Cu Pillar Fatigue in Exposed Die 3D Packages.”
IMAPSource Proceedings
2016 (DPC): 591–610.
https://doi.org/10.4071/2016DPC-TP12
.
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