Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Impact of Top Die Thickness on Cu Pillar Fatigue in Exposed Die 3D Packages
Impact of Top Die Thickness on Cu Pillar Fatigue in Exposed Die 3D Packages
Rahul Agarwal, Sukesh Kannan, Shan Gao, Rick Reed, Yong Song, JS Paek,
Agarwal, Rahul, Sukesh Kannan, Shan Gao, Rick Reed, Yong Song, and JS Paek. 2016. “Impact of Top Die Thickness on Cu Pillar Fatigue in Exposed Die 3D Packages.” IMAPSource Proceedings 2016 (DPC): 591–610. https://doi.org/10.4071/2016DPC-TP12.