Impact of Top Die Thickness on Cu Pillar Fatigue in Exposed Die 3D Packages

Rahul Agarwal; Sukesh Kannan; Shan Gao; Rick Reed; Yong Song; JS Paek

doi:10.4071/2016DPC-TP12

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Agarwal, Rahul, Sukesh Kannan, Shan Gao, Rick Reed, Yong Song, and JS Paek. 2016. “Impact of Top Die Thickness on Cu Pillar Fatigue in Exposed Die 3D Packages.” IMAPSource Proceedings 2016 (DPC): 591–610. https://doi.org/10.4071/2016DPC-TP12.

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