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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016January 01, 2016 EDT

An Innovative Package EMC Solution Using a Highly Cost-Effective Sputtered Conformal Shield

Nozad Karim, Rong Zhou, Jun Fan,
Conformal ShieldingEMI SolutionPackage EMC Solution
https://doi.org/10.4071/2016DPC-THA42
IMAPSource Conference Papers
Karim, Nozad, Rong Zhou, and Jun Fan. 2016. “An Innovative Package EMC Solution Using a Highly Cost-Effective Sputtered Conformal Shield.” IMAPSource Proceedings 2016 (DPC): 2152–81. https:/​/​doi.org/​10.4071/​2016DPC-THA42.

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