A study on warpage behavior of EMC in post-mold cure stage using Moldex3D

Hsu Chih-Chung; Srikar Vallury; Srikar Vallury; Kai Lin; Anthony Yang

doi:10.4071/2016DPC-TP25

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Chih-Chung, Hsu, Srikar Vallury, Srikar Vallury, Kai Lin, and Anthony Yang. 2016. “A Study on Warpage Behavior of EMC in Post-Mold Cure Stage Using Moldex3D.” IMAPSource Proceedings 2016 (DPC): 826–50. https://doi.org/10.4071/2016DPC-TP25.

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