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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016
January 01, 2016 EDT
Innovated Process Integration for Panel Size Glass Substrate Manufacturing for SiP Application
Yu-Hua Chen
,
Yu-Chung Hsieh
,
Wei-Di Lin
,
Chun-Hsien Chien
,
Dyi-Chung Hu
,
Glass Substrate
Panel Size
via in via or direct metallization
•
https://doi.org/10.4071/2016DPC-THA13
IMAPSource Conference Papers
Chen, Yu-Hua, Yu-Chung Hsieh, Wei-Di Lin, Chun-Hsien Chien, and Dyi-Chung Hu. 2016. “Innovated Process Integration for Panel Size Glass Substrate Manufacturing for SiP Application.”
IMAPSource Proceedings
2016 (DPC): 1893–1917.
https://doi.org/10.4071/2016DPC-THA13
.
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