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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016January 01, 2016 EDT

Innovated Process Integration for Panel Size Glass Substrate Manufacturing for SiP Application

Yu-Hua Chen, Yu-Chung Hsieh, Wei-Di Lin, Chun-Hsien Chien, Dyi-Chung Hu,
Glass Substrate Panel Size via in via or direct metallization
• https://doi.org/10.4071/2016DPC-THA13
IMAPSource Conference Papers
Chen, Yu-Hua, Yu-Chung Hsieh, Wei-Di Lin, Chun-Hsien Chien, and Dyi-Chung Hu. 2016. “Innovated Process Integration for Panel Size Glass Substrate Manufacturing for SiP Application.” IMAPSource Proceedings 2016 (DPC): 1893–1917. https://doi.org/10.4071/2016DPC-THA13.
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