ISSN 2380-4505
Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Precise, high throughput dispensing of thermal interface material in BGA packaging applications
Precise, high throughput dispensing of thermal interface material in BGA packaging applications
Hanzhuang Liang, Linh Rolland,
Liang, Hanzhuang, and Linh Rolland. 2016. “Precise, High Throughput Dispensing of Thermal Interface Material in BGA Packaging Applications.” IMAPSource Proceedings 2016 (DPC): 1391–1412. https://doi.org/10.4071/2016DPC-WP24.