Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Current status and future prospects of panel level packaging
Current status and future prospects of panel level packaging
Santosh Kumar, Amandine Pizzagalli, Dave Towne, Thibault Buisson, Andrej Ivankovic, Rozalia Beica,
Kumar, Santosh, Amandine Pizzagalli, Dave Towne, Thibault Buisson, Andrej Ivankovic, and Rozalia Beica. 2016. “Current Status and Future Prospects of Panel Level Packaging.” IMAPSource Proceedings 2016 (DPC): 707–50. https://doi.org/10.4071/2016DPC-TP21.