ISSN 2380-4505
Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Characterization of Clean after Photoresist Removal from Wafers with Copper Pillars with Lead-Free Solder Caps
Characterization of Clean after Photoresist Removal from Wafers with Copper Pillars with Lead-Free Solder Caps
Kimberly Pollard, Richie Peters, Michael Phenis, Don Pfettscher,
Pollard, Kimberly, Richie Peters, Michael Phenis, and Don Pfettscher. 2016. “Characterization of Clean after Photoresist Removal from Wafers with Copper Pillars with Lead-Free Solder Caps.” IMAPSource Proceedings 2016 (DPC): 421–36. https://doi.org/10.4071/2016DPC-TA24.