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High Temperature Conference Papers
Vol. 2010, Issue HITEC, 2010
January 01, 2010 EDT
Metallurgy for SiC Die Attach for Operation at 500°C
Ping Zheng
,
Phillip Henson
,
R. Wayne Johnson
,
Liangyu Chen
,
High temperature
die attach
Ag migration
LTP bonding
•
https://doi.org/10.4071/HITEC-RWJohnson-TA13
IMAPSource Conference Papers
Zheng, Ping, Phillip Henson, R. Wayne Johnson, and Liangyu Chen. 2010. “Metallurgy for SiC Die Attach for Operation at 500°C.”
IMAPSource Proceedings
2010 (HITEC): 8–17.
https://doi.org/10.4071/HITEC-RWJohnson-TA13
.
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