Vol. 2010, Issue HITEC, 2010January 01, 2010 EDT
Metallurgy for SiC Die Attach for Operation at 500°C
Metallurgy for SiC Die Attach for Operation at 500°C
Ping Zheng, Phillip Henson, R. Wayne Johnson, Liangyu Chen,
Zheng, Ping, Phillip Henson, R. Wayne Johnson, and Liangyu Chen. 2010. “Metallurgy for SiC Die Attach for Operation at 500°C.” IMAPSource Proceedings 2010 (HITEC): 8–17. https://doi.org/10.4071/HITEC-RWJohnson-TA13.