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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016
January 01, 2016 EDT
Laser-based Package Singulation and Trenching for SiP
Dirk Mueller
,
David Clark
,
Joris VanNunen
,
Ed Rea
,
Hatim Haloui
,
SiP cutting
SiP trenching
Laser cutting
•
https://doi.org/10.4071/2016DPC-THA43
IMAPSource Conference Papers
Mueller, Dirk, David Clark, Joris VanNunen, Ed Rea, and Hatim Haloui. 2016. “Laser-Based Package Singulation and Trenching for SiP.”
IMAPSource Proceedings
2016 (DPC): 2182–2202.
https://doi.org/10.4071/2016DPC-THA43
.
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