Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Laser-based Package Singulation and Trenching for SiP
Laser-based Package Singulation and Trenching for SiP
Dirk Mueller, David Clark, Joris VanNunen, Ed Rea, Hatim Haloui,
Mueller, Dirk, David Clark, Joris VanNunen, Ed Rea, and Hatim Haloui. 2016. “Laser-Based Package Singulation and Trenching for SiP.” IMAPSource Proceedings 2016 (DPC): 2182–2202. https://doi.org/10.4071/2016DPC-THA43.