ISSN 2380-4505
Vol. 2010, Issue HITEC, 2010January 01, 2010 EDT
Assessment of Au-Ge Die Attachment for an Extended Junction Temperature Range in Power Applications
Assessment of Au-Ge Die Attachment for an Extended Junction Temperature Range in Power Applications
Satoshi Tanimoto, Kohei Matsui, Yoshinori Murakami, Hiroshi Yamaguchi, Hajime Okumura,
Tanimoto, Satoshi, Kohei Matsui, Yoshinori Murakami, Hiroshi Yamaguchi, and Hajime Okumura. 2010. “Assessment of Au-Ge Die Attachment for an Extended Junction Temperature Range in Power Applications.” IMAPSource Proceedings 2010 (HITEC): 32–39. https://doi.org/10.4071/HITEC-STanimoto-TA16.