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High Temperature Conference Papers
Vol. 2010, Issue HITEC, 2010January 01, 2010 EDT

Characterization of Thick Film Technology for 300°C Packaging

Rui Zhang, R. Wayne Johnson, Vinayak Tilak, Tan Zhang, David Shaddock,
High Temperature Packaging Thick Film
• https://doi.org/10.4071/HITEC-RWJohnson-TP12
IMAPSource Conference Papers
Zhang, Rui, R. Wayne Johnson, Vinayak Tilak, Tan Zhang, and David Shaddock. 2010. “Characterization of Thick Film Technology for 300°C Packaging.” IMAPSource Proceedings 2010 (HITEC): 97–107. https://doi.org/10.4071/HITEC-RWJohnson-TP12.
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