Characterization of Thick Film Technology for 300°C Packaging

Rui Zhang; R. Wayne Johnson; Vinayak Tilak; Tan Zhang; David Shaddock

doi:10.4071/HITEC-RWJohnson-TP12

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Zhang, Rui, R. Wayne Johnson, Vinayak Tilak, Tan Zhang, and David Shaddock. 2010. “Characterization of Thick Film Technology for 300°C Packaging.” IMAPSource Proceedings 2010 (HITEC): 97–107. https://doi.org/10.4071/HITEC-RWJohnson-TP12.

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