Vol. 2010, Issue HITEC, 2010January 01, 2010 EDT
Development of a SiC SSPC Module with Advanced High Temperature Packaging
Development of a SiC SSPC Module with Advanced High Temperature Packaging
Hopkins, Douglas C, Yuan-Bo Guo, Herbert E Dwyer, and James D. Scofield. 2010. “Development of a SiC SSPC Module with Advanced High Temperature Packaging.” IMAPSource Proceedings 2010 (HITEC): 310–15. https://doi.org/10.4071/HITEC-DHopkins-WP25.
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