Vol. 2010, Issue HITEC, 2010January 01, 2010 EDT
Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits
Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits
S T Riches, K Cannon, C Johnston, M Sousa, P Grant, J Gulliver, M Langley, R Pittson, S Serban, D Baghurst, M Firmstone,
Riches, S T, K Cannon, C Johnston, M Sousa, P Grant, J Gulliver, M Langley, et al. 2010. “Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits.” IMAPSource Proceedings 2010 (HITEC): 89–96. https://doi.org/10.4071/HITEC-SRiches-TP11.
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