Swelling Phenomena in Sintered Silver Die Attach Structures at High Temperatures: Reliability Problems and Solutions for an Operation above 350°C

N. Heuck; S. Müller; G. Palm; A. Bakin; A. Waag

doi:10.4071/HITEC-NHeuck-TA14

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Heuck, N., S. Müller, G. Palm, A. Bakin, and A. Waag. 2010. “Swelling Phenomena in Sintered Silver Die Attach Structures at High Temperatures: Reliability Problems and Solutions for an Operation above 350°C.” IMAPSource Proceedings 2010 (HITEC): 18–25. https://doi.org/10.4071/HITEC-NHeuck-TA14.

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