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High Temperature Conference Papers
Vol. 2010, Issue HITEC, 2010January 01, 2010 EDT

Swelling Phenomena in Sintered Silver Die Attach Structures at High Temperatures: Reliability Problems and Solutions for an Operation above 350°C

N. Heuck, S. Müller, G. Palm, A. Bakin, A. Waag,
sinteredsilverdie attachhigh temperature350CsubstratesinteringLTJT
https://doi.org/10.4071/HITEC-NHeuck-TA14
IMAPSource Conference Papers
Heuck, N., S. Müller, G. Palm, A. Bakin, and A. Waag. 2010. “Swelling Phenomena in Sintered Silver Die Attach Structures at High Temperatures: Reliability Problems and Solutions for an Operation above 350°C.” IMAPSource Proceedings 2010 (HITEC): 18–25. https:/​/​doi.org/​10.4071/​HITEC-NHeuck-TA14.
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