Vol. 2010, Issue HITEC, 2010January 01, 2010 EDT
Swelling Phenomena in Sintered Silver Die Attach Structures at High Temperatures: Reliability Problems and Solutions for an Operation above 350°C
Swelling Phenomena in Sintered Silver Die Attach Structures at High Temperatures: Reliability Problems and Solutions for an Operation above 350°C
N. Heuck, S. Müller, G. Palm, A. Bakin, A. Waag,
Heuck, N., S. Müller, G. Palm, A. Bakin, and A. Waag. 2010. “Swelling Phenomena in Sintered Silver Die Attach Structures at High Temperatures: Reliability Problems and Solutions for an Operation above 350°C.” IMAPSource Proceedings 2010 (HITEC): 18–25. https://doi.org/10.4071/HITEC-NHeuck-TA14.