Vol. 2010, Issue HITEC, 2010January 01, 2010 EDT
Thermomechanical Stresses in Copper Films at Elevated Temperature
Thermomechanical Stresses in Copper Films at Elevated Temperature
Martin Lederer, Javad Zarbakhsh, Rui Huang, Thomas Detzel, Brigitte Weiss,
Lederer, Martin, Javad Zarbakhsh, Rui Huang, Thomas Detzel, and Brigitte Weiss. 2010. “Thermomechanical Stresses in Copper Films at Elevated Temperature.” IMAPSource Proceedings 2010 (HITEC): 129–35. https://doi.org/10.4071/HITEC-JZarbakhsh-TP16.