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High Temperature Conference Papers
Vol. 2010, Issue HITEC, 2010
January 01, 2010 EDT
Edge-Controlled Mechanical Failure of Si and SiC Semiconductor Chips
A. A. Wereszczak
,
O. M. Jadaan
,
T. P. Kirkland
,
Weibull distribution
failure probability
strength
tensile stress
strength-limiting flaw
reliability
•
https://doi.org/10.4071/HITEC-AWereszczak-THA11
IMAPSource Conference Papers
Wereszczak, A. A., O. M. Jadaan, and T. P. Kirkland. 2010. “Edge-Controlled Mechanical Failure of Si and SiC Semiconductor Chips.”
IMAPSource Proceedings
2010 (HITEC): 325–32.
https://doi.org/10.4071/HITEC-AWereszczak-THA11
.
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