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High Temperature Conference Papers
Vol. 2010, Issue HITEC, 2010January 01, 2010 EDT

Assessing the Reliability of Die Attach Materials in Electronic Packages for High Temperature Applications

M.F. Sousa, S. Riches, C. Johnston, P.S. Grant,
die attach materialsECAsAu-Sihigh-temperature electronicsreliabilitymodelling
https://doi.org/10.4071/HITEC-MSousa-TA11
IMAPSource Conference Papers
Sousa, M.F., S. Riches, C. Johnston, and P.S. Grant. 2010. “Assessing the Reliability of Die Attach Materials in Electronic Packages for High Temperature Applications.” IMAPSource Proceedings 2010 (HITEC): 1–6. https:/​/​doi.org/​10.4071/​HITEC-MSousa-TA11.
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