Vol. 2010, Issue HITEC, 2010January 01, 2010 EDT
Assessing the Reliability of Die Attach Materials in Electronic Packages for High Temperature Applications
Assessing the Reliability of Die Attach Materials in Electronic Packages for High Temperature Applications
Sousa, M.F., S. Riches, C. Johnston, and P.S. Grant. 2010. “Assessing the Reliability of Die Attach Materials in Electronic Packages for High Temperature Applications.” IMAPSource Proceedings 2010 (HITEC): 1–6. https://doi.org/10.4071/HITEC-MSousa-TA11.
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