Packaging Technology for High Temperature Capacitive Pressure Sensors

Liang-Yu Chen; Glenn M. Beheim; Roger D. Meredith

doi:10.4071/HITEC-LChen-THA23

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Chen, Liang-Yu, Glenn M. Beheim, and Roger D. Meredith. 2010. “Packaging Technology for High Temperature Capacitive Pressure Sensors.” IMAPSource Proceedings 2010 (HITEC): 367–72. https://doi.org/10.4071/HITEC-LChen-THA23.

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