Vol. 2010, Issue HITEC, 2010January 01, 2010 EDT
Packaging Technology for High Temperature Capacitive Pressure Sensors
Packaging Technology for High Temperature Capacitive Pressure Sensors
Liang-Yu Chen, Glenn M. Beheim, Roger D. Meredith,
Chen, Liang-Yu, Glenn M. Beheim, and Roger D. Meredith. 2010. “Packaging Technology for High Temperature Capacitive Pressure Sensors.” IMAPSource Proceedings 2010 (HITEC): 367–72. https://doi.org/10.4071/HITEC-LChen-THA23.