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High Temperature Conference Papers
Vol. 2010, Issue HITEC, 2010
January 01, 2010 EDT
Packaging Technology for High Temperature Capacitive Pressure Sensors
Liang-Yu Chen
,
Glenn M. Beheim
,
Roger D. Meredith
,
high temperature
packaging
pressure sensor
•
https://doi.org/10.4071/HITEC-LChen-THA23
IMAPSource Conference Papers
Chen, Liang-Yu, Glenn M. Beheim, and Roger D. Meredith. 2010. “Packaging Technology for High Temperature Capacitive Pressure Sensors.”
IMAPSource Proceedings
2010 (HITEC): 367–72.
https://doi.org/10.4071/HITEC-LChen-THA23
.
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