Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Polyamide 4T: A New Lead-Free Solderable Polymer Enabling Packaging Technology Through Micro Molding and LDS
Polyamide 4T: A New Lead-Free Solderable Polymer Enabling Packaging Technology Through Micro Molding and LDS
Tamim Sidiki,
Sidiki, Tamim. 2010. “Polyamide 4T: A New Lead-Free Solderable Polymer Enabling Packaging Technology Through Micro Molding and LDS.” IMAPSource Proceedings 2010 (DPC): 1563–84. https://doi.org/10.4071/2010DPC-wa43.