Underfill Induced Tensile Strain Ratcheting and its Effect on Flip Chip Solder Bump Fatigue

Craig D. Hillman; Randy Schueller; Greg Caswell

doi:10.4071/2010DPC-ta34

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Hillman, Craig D., Randy Schueller, and Greg Caswell. 2010. “Underfill Induced Tensile Strain Ratcheting and Its Effect on Flip Chip Solder Bump Fatigue.” IMAPSource Proceedings 2010 (DPC): 737–58. https://doi.org/10.4071/2010DPC-ta34.

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