Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010
January 01, 2010 EDT
Underfill Induced Tensile Strain Ratcheting and its Effect on Flip Chip Solder Bump Fatigue
Craig D. Hillman
,
Randy Schueller
,
Greg Caswell
,
underfill
low Tg
reliability effects
•
https://doi.org/10.4071/2010DPC-ta34
IMAPSource Conference Papers
Hillman, Craig D., Randy Schueller, and Greg Caswell. 2010. “Underfill Induced Tensile Strain Ratcheting and Its Effect on Flip Chip Solder Bump Fatigue.”
IMAPSource Proceedings
2010 (DPC): 737–58.
https://doi.org/10.4071/2010DPC-ta34
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats