Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Underfill Induced Tensile Strain Ratcheting and its Effect on Flip Chip Solder Bump Fatigue
Underfill Induced Tensile Strain Ratcheting and its Effect on Flip Chip Solder Bump Fatigue
Craig D. Hillman, Randy Schueller, Greg Caswell,
Hillman, Craig D., Randy Schueller, and Greg Caswell. 2010. “Underfill Induced Tensile Strain Ratcheting and Its Effect on Flip Chip Solder Bump Fatigue.” IMAPSource Proceedings 2010 (DPC): 737–58. https://doi.org/10.4071/2010DPC-ta34.