Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Study of Thermo-Mechanical Reliability of TSV for 8-Layer Stacked Multi Chip Package
Study of Thermo-Mechanical Reliability of TSV for 8-Layer Stacked Multi Chip Package
Choa, Sung-Hoon, Jin Young Choi, Cha Gyu Song, and Haeng Soo Lee. 2010. “Study of Thermo-Mechanical Reliability of TSV for 8-Layer Stacked Multi Chip Package.” IMAPSource Proceedings 2010 (DPC): 1697–1725. https://doi.org/10.4071/2010DPC-wp13.
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