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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010
January 01, 2010 EDT
Process Control for Wet Etching for Silicon Wafer Thinning
Laura Mauer
,
Herman Itzkowitz
,
John Taddei
,
silicon etching
wafer thinning
process control
•
https://doi.org/10.4071/2010DPC-tp33
IMAPSource Conference Papers
Mauer, Laura, Herman Itzkowitz, and John Taddei. 2010. “Process Control for Wet Etching for Silicon Wafer Thinning.”
IMAPSource Proceedings
2010 (DPC): 1030–53.
https://doi.org/10.4071/2010DPC-tp33
.
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