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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT

Through Silicon Via Technology: Cost effective Cu-TSV Interconnects by EMC3D and Technical Challenges with Cu-TSV

Paul Siblerud, Rozalia Beica, Bioh Kim, Erik Young,
CoOTSVEMC3D
https://doi.org/10.4071/2010DPC-ta11
IMAPSource Conference Papers
Siblerud, Paul, Rozalia Beica, Bioh Kim, and Erik Young. 2010. “Through Silicon Via Technology: Cost Effective Cu-TSV Interconnects by EMC3D and Technical Challenges with Cu-TSV.” IMAPSource Proceedings 2010 (DPC): 425–45. https:/​/​doi.org/​10.4071/​2010DPC-ta11.
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