Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Through Silicon Via Technology: Cost effective Cu-TSV Interconnects by EMC3D and Technical Challenges with Cu-TSV
Through Silicon Via Technology: Cost effective Cu-TSV Interconnects by EMC3D and Technical Challenges with Cu-TSV
Siblerud, Paul, Rozalia Beica, Bioh Kim, and Erik Young. 2010. “Through Silicon Via Technology: Cost Effective Cu-TSV Interconnects by EMC3D and Technical Challenges with Cu-TSV.” IMAPSource Proceedings 2010 (DPC): 425–45. https://doi.org/10.4071/2010DPC-ta11.
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