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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT

A Comparison of Flip Chip Bump Electromigration Reliability for Cu Pillar, High Pb, SnAg, and SnPb Bump Structures

Ahmer Syed, Karthikeyan Dhandapani, Lou Nicholls, Robert Moody, C. J. Berry, Robert Darveaux,
Flip-chip bumpsElectromigrationReliability
https://doi.org/10.4071/2010DPC-wa33
IMAPSource Conference Papers
Syed, Ahmer, Karthikeyan Dhandapani, Lou Nicholls, Robert Moody, C. J. Berry, and Robert Darveaux. 2010. “A Comparison of Flip Chip Bump Electromigration Reliability for Cu Pillar, High Pb, SnAg, and SnPb Bump Structures.” IMAPSource Proceedings 2010 (DPC): 1443–64. https:/​/​doi.org/​10.4071/​2010DPC-wa33.
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