Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
A Comparison of Flip Chip Bump Electromigration Reliability for Cu Pillar, High Pb, SnAg, and SnPb Bump Structures
A Comparison of Flip Chip Bump Electromigration Reliability for Cu Pillar, High Pb, SnAg, and SnPb Bump Structures
Ahmer Syed, Karthikeyan Dhandapani, Lou Nicholls, Robert Moody, C. J. Berry, Robert Darveaux,
Syed, Ahmer, Karthikeyan Dhandapani, Lou Nicholls, Robert Moody, C. J. Berry, and Robert Darveaux. 2010. “A Comparison of Flip Chip Bump Electromigration Reliability for Cu Pillar, High Pb, SnAg, and SnPb Bump Structures.” IMAPSource Proceedings 2010 (DPC): 1443–64. https://doi.org/10.4071/2010DPC-wa33.