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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT

Implementing Fringing Field Sensors in PCB Technology

Robert Dean, Aditi Rane, Colin Stevens, Michael Baginski, Zane Hartzog, David Elton,
MEMSFringing Field SensorCapacitance
https://doi.org/10.4071/2010DPC-ta22
IMAPSource Conference Papers
Dean, Robert, Aditi Rane, Colin Stevens, Michael Baginski, Zane Hartzog, and David Elton. 2010. “Implementing Fringing Field Sensors in PCB Technology.” IMAPSource Proceedings 2010 (DPC): 579–98. https:/​/​doi.org/​10.4071/​2010DPC-ta22.
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