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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010
January 01, 2010 EDT
Electromigration Performance of WLPs with Standard and Polymer Core Balls
L. Nguyen
,
H. Nguyen
,
A. Prabhu
,
Electromigration
Polymer core solder balls
Wafer level package
•
https://doi.org/10.4071/2010DPC-tha35
IMAPSource Conference Papers
Nguyen, L., H. Nguyen, and A. Prabhu. 2010. “Electromigration Performance of WLPs with Standard and Polymer Core Balls.”
IMAPSource Proceedings
2010 (DPC): 2361–92.
https://doi.org/10.4071/2010DPC-tha35
.
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