Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Electrolytic Solder Deposit for Next Generation Flip Chip Solder Bumping
Electrolytic Solder Deposit for Next Generation Flip Chip Solder Bumping
Stephen Kenny, Sven Lamprecht, Kai Matejat, Bernd Roelfs,
Kenny, Stephen, Sven Lamprecht, Kai Matejat, and Bernd Roelfs. 2010. “Electrolytic Solder Deposit for Next Generation Flip Chip Solder Bumping.” IMAPSource Proceedings 2010 (DPC): 671–707. https://doi.org/10.4071/2010DPC-ta31.