Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Direct Cu Wet Seed on Barrier of TSV Wafer
Direct Cu Wet Seed on Barrier of TSV Wafer
Jianwen Han, Xuan Lin, Yun Zhang, Joseph Aby, Thierry Mourier,
Han, Jianwen, Xuan Lin, Yun Zhang, Joseph Aby, and Thierry Mourier. 2010. “Direct Cu Wet Seed on Barrier of TSV Wafer.” IMAPSource Proceedings 2010 (DPC): 759–73. https://doi.org/10.4071/2010DPC-tp12.