Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Integration Aspects of the Implementation of Through Silicon Vias (TSV) for CMOS Image Sensors
Integration Aspects of the Implementation of Through Silicon Vias (TSV) for CMOS Image Sensors
Dave Thomas, Jean Michailos, Nicolas Hotellier, Gilles Metellus, Francois Guyader, Alain Inard, Keith Buchanan, Dorleta Cortaberria Sanz, Yiping Song, Tony Wilby,
Thomas, Dave, Jean Michailos, Nicolas Hotellier, Gilles Metellus, Francois Guyader, Alain Inard, Keith Buchanan, Dorleta Cortaberria Sanz, Yiping Song, and Tony Wilby. 2010. “Integration Aspects of the Implementation of Through Silicon Vias (TSV) for CMOS Image Sensors.” IMAPSource Proceedings 2010 (DPC): 539–56. https://doi.org/10.4071/2010DPC-ta14.
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