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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT

A Robust Wafer-Level Capping Approach for MEMS Devices

Krishnan Seetharaman, Bart van Velzen, Hans van Zadelhoff, Cadmus Yuan, Frank Rietveld, Coen Tak, Joost van Beek, Jan-Jaap Koning, Peter H. C. Magnée, Johannes van Wingerden, Herman C. W. Beijerinck,
Thin-film cappingFront-end technologyBAW resonatorBack-end operations
https://doi.org/10.4071/2010DPC-tp21
IMAPSource Conference Papers
Seetharaman, Krishnan, Bart van Velzen, Hans van Zadelhoff, Cadmus Yuan, Frank Rietveld, Coen Tak, Joost van Beek, et al. 2010. “A Robust Wafer-Level Capping Approach for MEMS Devices.” IMAPSource Proceedings 2010 (DPC): 891–924. https:/​/​doi.org/​10.4071/​2010DPC-tp21.
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