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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT

Die-to-Wafer Bonding of Thin Dies using a 2-Step Approach; High Accuracy Placement, then Gang Bonding

Gilbert Lecarpentier, Rahul Agarwal, Wenqi Zhang, Paresh Limaye, Riet Labie, A. Phommahaxay, P. Soussan,
Die-to-WaferStackCollective hybrid bonding
https://doi.org/10.4071/2010DPC-wa14
IMAPSource Conference Papers
Lecarpentier, Gilbert, Rahul Agarwal, Wenqi Zhang, Paresh Limaye, Riet Labie, A. Phommahaxay, and P. Soussan. 2010. “Die-to-Wafer Bonding of Thin Dies Using a 2-Step Approach; High Accuracy Placement, Then Gang Bonding.” IMAPSource Proceedings 2010 (DPC): 1254–81. https:/​/​doi.org/​10.4071/​2010DPC-wa14.
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