Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT

3D Interconnect: The Challenges Ahead

Brandon Prior,
3D Interconnect WL-CSP TSV
• https://doi.org/10.4071/2010DPC-keynote1_3D
IMAPSource Conference Papers
Prior, Brandon. 2010. “3D Interconnect: The Challenges Ahead.” IMAPSource Proceedings 2010 (DPC): 380–405. https://doi.org/10.4071/2010DPC-keynote1_3D.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system