Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010
January 01, 2010 EDT
3D Interconnect: The Challenges Ahead
Brandon Prior
,
3D Interconnect
WL-CSP
TSV
•
https://doi.org/10.4071/2010DPC-keynote1_3D
IMAPSource Conference Papers
Prior, Brandon. 2010. “3D Interconnect: The Challenges Ahead.”
IMAPSource Proceedings
2010 (DPC): 380–405.
https://doi.org/10.4071/2010DPC-keynote1_3D
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats
