Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing To Avoid Thin Wafer Handling
Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing To Avoid Thin Wafer Handling
Zussman, Mel, Chris Milasincic, Anthony Rardin, Simon Kirk, and T. Itabshi. 2010. “Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing To Avoid Thin Wafer Handling.” IMAPSource Proceedings 2010 (DPC): 859–90. https://doi.org/10.4071/2010DPC-tp16.
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