Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing To Avoid Thin Wafer Handling
Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing To Avoid Thin Wafer Handling
Mel Zussman, Chris Milasincic, Anthony Rardin, Simon Kirk, T. Itabshi,
Zussman, Mel, Chris Milasincic, Anthony Rardin, Simon Kirk, and T. Itabshi. 2010. “Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing To Avoid Thin Wafer Handling.” IMAPSource Proceedings 2010 (DPC): 859–90. https://doi.org/10.4071/2010DPC-tp16.