Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Stacking of Known Good Rebuilt Wafers without TSV - Applications to Memories and SiP
Stacking of Known Good Rebuilt Wafers without TSV - Applications to Memories and SiP
Val, Christian, Pascal Couderc, and Pierre Lartigues. 2010. “Stacking of Known Good Rebuilt Wafers without TSV - Applications to Memories and SiP.” IMAPSource Proceedings 2010 (DPC): 2020–74. https://doi.org/10.4071/2010DPC-tha12.
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